Ultra-miniature switch allows high density mounting, and extremely light weight of 0.6g makes this switch ideal for handheld equipment. Heat resistant resin used for housing, base, and plunger allows vapor phase and infrared convection reflow soldering. Combination of design features achieves total seal and allows automated processing techniques, including flux cleaning procedures, one-piece bushing and housing, rubber seals surrounding actuator and base, epoxy at joint of case and base, and molded-in, epoxy-sealed terminals.